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--- limulus_compute_blades [2021/05/04 15:15]
brandonm [Physical Configuration/RAS] Word and punctuation fixes
+++ limulus_compute_blades [2021/05/04 15:23] (current)
brandonm [Conclusion] Word and punctuation fixes
@@ Line 122: / Line 122: @@
 ==== 3-D Printed Flexibility====
-The use of 3-D printing helps lower construction cost and provides a new level of system flexibility.  Costs are lower because there is no need to buy sheet metal or injection molded parts in high quantity. Since 3-D printed parts are printed "on demand," design changes and customized solutions are easily managed. In addition, 3-D printing can be used to create sophisticated shapes that might otherwise be expensive, difficult, or impossible to create with other manufacturing methodologies.
+The use of 3-D printing helps lower construction cost and provides a new level of system flexibility.  Costs are lower because there is no need to buy sheet metal or injection-molded parts in high quantity. Since 3-D printed parts are printed "on demand," design changes and customized solutions are easily managed. In addition, 3-D printing can be used to create sophisticated shapes that might otherwise be expensive, difficult, or impossible to create with other manufacturing methodologies.
 ====Environmental====
-Limulus systems are designed to work in non-data center environments (Edge Computing). The Limulus 2.0 μATX blades are designed to run quietly (equipped with efficient CPU coolers and fans) and produce low amounts of heat due to the use of lower TDP processors.
+Limulus systems are designed to work in non-data center environments (Edge Computing). The Limulus 2.0 μATX blades are designed to run quietly (equipped with efficient CPU coolers and fans) and produce low amounts of heat due to the use of lower-TDP processors.
 Blades are designed to be used in close quarters in ventilated, yet rugged, environments. Other than the processor cooler, there are no moving parts. All non-blade storage is external to the blade, allowing multiple removable storage devices to be used with each blade.  All blades have at least one internal SSD NVMe slot.
-A central issue for all computing equipment is the accumulation of dust within the components (due to the need for moving air to cool hot components). Because the blades are designed to use cooler processors, the amount of cooling (moving air) is less than hotter processors. Thus, using a case with proper air filters (such as those used for Limulus systems) blades normally do not experience large amounts of dust accumulation. In addition, should dust find its way to a blade, it is easily removed and cleaned using compressed air.
+A central issue for all computing equipment is the accumulation of dust within the components (due to the need for moving air to cool hot components). Because the blades are designed to use cooler processors, the amount of cooling (moving air) is less than for hotter processors. Thus, using a case with proper air filters (such as those used for Limulus systems), blades normally do not experience large amounts of dust accumulation. In addition, should dust find its way to a blade, it is easily removed and cleaned using compressed air.
-Concerns about 3-D printed parts in a "hot" computing environment are not an issue. First, systems are designed to run cool and have plenty of moving air and case ventilation to remove heat. Second, during normal operation, the hottest parts of the system are the CPUs and active coolers. These devices are not near or in contact with any 3-D printed parts. Modern processors can reach temperatures of 70-85° C before they internally throttle the clock (thus, reducing the amount of heat generated). Limulus nodes are also monitored and have a default throttling temperature (72°C) that will initiate kernel level throttling, if needed. Finally, all parts are printed (and annealed) using high performance PLA. The resulting parts start to become soft between 75-85°C. It would take some work to seal off the case so that the internal temperature reaches this range. In addition, at these temperatures, many  other things would not work.
+Concerns about 3-D printed parts in a "hot" computing environment are not an issue. First, systems are designed to run cool and have plenty of moving air and case ventilation to remove heat. Second, during normal operation, the hottest parts of the system are the CPUs and active coolers. These devices are not near or in contact with any 3-D printed parts. Modern processors can reach temperatures of 70-85 °C before they internally throttle the clock (thus reducing the amount of heat generated). Limulus nodes are also monitored and have a default throttling temperature (72 °C) that will initiate kernel-level throttling, if needed. Finally, all parts are printed (and annealed) using high performance PLA. The resulting parts start to become soft between 75-85 °C. It would take some work to seal off the case so that the internal temperature reaches this range. In addition, at these temperatures, many  other things would not work.
 ====Conclusion====
-The Limulus 2.0 μATX blade design provides convenient "big compute" to non-data center environments. Optimal design and the use of 3-D printing provides a powerful yet flexible approach to local computing solutions (e.g. office, lab, classroom, or factory). In addition, the use of high-quality commodity priced components allows industry leading price to performance. The modular design allows virtually any standard μATX motherboard and off-the-shelf hardware to be combined into a dense high-performance computing resource.
+The Limulus 2.0 μATX blade design provides convenient "big computing" to non-data center environments. Optimal design and the use of 3-D printing provides a powerful yet flexible approach to local computing solutions (e.g. for the office, lab, classroom, or factory). In addition, the use of high-quality commodity-priced components allows industry-leading price to performance. The modular design allows virtually any standard μATX motherboard and off-the-shelf hardware to be combined into a dense, high-performance computing resource.

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